Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques
Shows how to protect devices from the environment and decrease package size for dramatic reduction of packaging costs
Discusses properties, preparation, and growth of silicon crystals and wafers
Explains the many properties (mechanical, electrostatic, optical, etc.), manufacturing, processing, measuring (incl. focused beam techniques), and multiscale modeling methods of MEMS structures
Description

The Handbook of Silicon Based MEMS Materials and Technologies is a comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on silicon as the most important starting material used in MEMS.
The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals and wafers. It also covers micromachining technologies in MEMS and encapsulation of MEMS components. Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques and shows how to protect devices from the environment and decrease package size for dramatic reduction of packaging costs. It is also rich on parameters and other data.
The book is geared towards practical applications rather than theory and therefore tailored for the needs of the MEMS industry. It is unique not only by its comprehensiveness, but also its detailed focus on hands-on aspects of silicon MEMS materials and manufacturing processes and complete product development.
The current edition anticipated well trends in the development of various MEMS markets in the recent years. Since the publication of current edition key technologies in MEMS manufacturing such as laser micromachining and vapor phase etching have matured. New technologies and topics, particularly in the areas of device manufacturing and packaging, have emerged, such as gas phase etching technologies of sacrificial layers, isotropic gas phase etching and eWBL technologies for MEMS packaging. The new edition addresses those developments with a thorough update and expansion of the current edition and by adding seven new chapters.
Written by over 70 world class MEMS contributors from around the globe and edited by leading researchers the Handbook of Silicon Based MEMS Materials and Technologies, Second Edition illustrates global cutting edge knowledge and expertise within the most vigorously growing industry today. It thereby fulfills the needs of device design engineers and process or development engineers as well as industrial R&D and academic communities working in MEMS manufacturing, precision engineering and microfabrication, in the MEMS industry and downstream industries ranging from consumer electronics to automotive and industrial applications.

Part 1; Silicon as MEMS Material (Part Editor: Markku Tilli)
1 Properties of Silicon (Markku Tilli and Atte Haapalinna)
2 Czochralski Growth of SiliconCrystals (Olli Anttila)
3 Properties of Silicon Crystals (Jari Paloheimo)
4 Oxygen in Silicon (tbc)
5 Silicon Wafers: Preparation and Properties (Markku Tilli)
6 Epi Wafers: Preparation and Properties (Douglas J. Meyer)
7 Thick-Film SOI Wafers: Preparation and Properties (Jari Mäkinen)
8 Silicon Dioxides (Simo Eränen)
NEW: Silicon-Germanium as a MEMS material (contributor from Bosch or Imec)
Part II; Modeling in MEMS (Part Editors: Teruaki Motooka and Risto Nieminen)
9 Multiscale Modeling Methods (Teruaki Motooka)
10 Manufacture and Processing of MEMS Structures (Miguel A. Gosálvez)
11 Mechanical Properties of Silicon Microstructures (Maria Ganchenkova and Risto Nieminen)
12 Electrostatic and RF-Properties of MEMS Structures (Ilkka Tittonen and Mika Koskenvuori)
13 Optical Modeling of MEMS (Timo Aalto and Juuso Olkkonen)
14 Gas Damping in Vibrating MEMS Structures (Timo Veijola)
Part III; Measuring MEMS (Part Editor: Veli-Matti Airaksinen)
15 Introduction to Measuring MEMS (Veli-Matti Airaksinen)
16 Silicon Wafer and Thin Film Measurements (Veli-Matti Airaksinen)
17 Optical Measurement of Static and Dynamic Displacement in MEMS (David Horsley)
18 MEMS Residual Stress Characterization: Methodology and Perspective (Kuo-Shen Chen & Kuang-Shun Ou)
19 Strength of Bonded Interfaces (Örjan Vallin & Kerstin Jonsson)
20 Focused Ion and Electron Beam Techniques (Oliver Wilhelmi, Steve Reyntjens, Brandon van Leer, Paul Anzalone and Lucille Giannuzzi)
21 Oxygen and Bulk Microdefects in Silicon (Hele Savin and Veli-Matti Airaksinen)
Part IV; Micromachining Technologies in MEMS (Part Editor: Sami Franssila)
22 MEMS Lithography (Sami Franssila and Santeri Tuomikoski)
23 Deep Reactive Ion Etching (Franz Laermer Sami Franssila Lauri Sainiemi and Kai Kolari)
24 Wet Etching of Silicon (M.A. Gosálvez, I. Zubel and E. Viinikka)
NEW: Laser machining (tbc)
25 Porous Silicon Based MEMS (Gerhard Müller, Alois Friedberger and Kathrin Knese)
26 Atomic Layer Deposition in MEMS Technology (Riikka L. Puurunen Hannu Kattelus and Tuomo Suntola)
NEW: Ink jet Printing (Matti Mäntysalo, TUT)
NEW: 3D Printing (Frank Niklaus, KTH)
27 Metallic Glass (Parmanand Sharma and Akihisa Inoue)
28 Surface Micromachining (Christina Leinenbach , Hannu Kattelus and Roy Knechtel)
29 Microfluidics (tbc)
NEW: Vapour phase HF etching (contributor from Primaxx)
NEW: Non-isotropic Silicon gas phase etching (contributor from Xactix)
Part V; Encapsulation of MEMS Components (Part Editor: Ari Lehto and Heikki Kuisma)
30 Introduction to encapsulation of MEMS (Heikki Kuisma)
31 Silicon Direct Bonding (Kimmo Henttinen)
32 Anodic Bonding (Adriana Cozma Lapadatu, Henrik Jakobsen)
33 Glass frit bonding (Roy Knechtel)
34 Metallic alloy seal bonding (Wolfgang Reinert, Dr.-Ing. Peter Merz)
35 Bonding of CMOS Processed Wafers (Roy Knechtel)
36 Non-Destructive Bond Strength Testing of Anodic Bonded Wafers (Roy Knechtel)
37 Wafer Bonding Equipment (Viorel Dragoi, Paul Lindner)
38 Encapsulation by Film Deposition (Rob N. Candler)
39Via Technologies for MEMS (Kimmo Henttinen)
40 Outgassing and gettering (Antonio Bonucci, Andrea Conte, Marco Moraja, Giorgio Longoni and Marco Amiotti)
41 Dicing of MEMS devices (Scott Sullivan)
42 Hermeticity Tests (Wolfgang Reinert, Dr.-Ing. Dirk Kähler)
NEW: eWLB technology in MEMS (tbc)
Appendix 1; Common Abbreviations & Acronyms
Appendix 2; Nanoindentation Characterization of Silicon & Other MEMS Materials (P. Zachariasz